Debond Equipment
TRITON Series
WSTC TRITON is a standalone, fully automatic debonding system. It can also be integrated as an in-situ module into CANOPUS bonders. The system supports wafer debonding operations, prior to the annealing process for both hybrid bonding and fusion bonding applications.
Features
Mechanical Debonding
Laser Debond Optional
High-Precision Blade Control
Low Chipping Rate
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