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D2W Hybrid Bonder

SIRIUS Series

Based on forward design and independent development, WSTC SIRIUS Hybrid Bonder enables direct embedded metal pads connection between multiples dies and a target wafer. It has achieved world-leading levels in key performance indicators such as bonding strength and overlay accuracy. It supports multiple integrated modules including pre-alignment, real-time alignment, plasma activation, cleaning, tape release and metrology.

Operation

Fully-automatic
Wafer diameter

300mm
Alignment accuracy

High accuracy
Integrated module

Alignment and Metrology, Activation, Cleaning, Tape release
Throughput

High throughput
Cleanliness control

ISO Class 1

Applications

Die-to-wafer hybrid bonding is a key process for achieving higher interconnection density with high yield and great flexibility. This equipment supports the manufacturing of heterogeneous and high performance 3D ICs.