W2W Fusion Bonder
CANOPUS Series
Based on forward design and independent development, WSTC CANOPUS Fusion Bonder enables direct connection via dielectric layers of wafers. It has achieved world-leading levels in key performance indicators such as bonding strength and overlay accuracy. It supports multiple integrated modules including alignment, plasma activation, cleaning, inspection, and debonding.
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OperationFully-automatic
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Wafer diameter300mm
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Alignment accuracyHigh accuracy
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Integrated moduleAlignment, Activation, Cleaning, Defect Inspection and Debonding
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ThroughputHigh throughput
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Cleanliness controlISO Class 1
Applications
Fusion bonding is a key process for achieving high-quality interface connection without the compromise of electrical and thermal properties of the materials involved. It finds applications in IC manufacturing at advanced nodes.
Logic CFET
Logic BSPDN
4F2 DRAM
CIS
SOI / POI
Features
Low Wafer Distortion
Edge Alignment
Room/Low Temperature Bonding
Smart Bonding Control
Highly Customized
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